Wafer Shipping System
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Description
Wafercon200
The SPI/Semicon� Wafer Storage and Shipping Systems includes A Wafer Jar and Lid, Foam Liner, Foam Cushion Discs, and Wafer Interleaf Discs.
Wafer Jars and Lids
Jars and Lids are manufactured from virgin polypropylene resin-no fillers or additives. Material is chemically resistant and has high impact strength.
Foam Liners
Manufactured from 1.25 LB density pink polyurethane antistatic foam. This product is non-corrosive, has excellent cushion properties, and low particle generation. Surface Resistivity (ASTM D256) measures 10�� Ohms/Sq. Meets MIL-B-81705 Static Decay Requirement (0 Cutoff) FTMS 101C, 4046 <2 Seconds.
The SPI/Semicon� Wafer Storage and Shipping Systems includes A Wafer Jar and Lid, Foam Liner, Foam Cushion Discs, and Wafer Interleaf Discs.
Wafer Jars and Lids
Jars and Lids are manufactured from virgin polypropylene resin-no fillers or additives. Material is chemically resistant and has high impact strength.
Foam Liners
Manufactured from 1.25 LB density pink polyurethane antistatic foam. This product is non-corrosive, has excellent cushion properties, and low particle generation. Surface Resistivity (ASTM D256) measures 10�� Ohms/Sq. Meets MIL-B-81705 Static Decay Requirement (0 Cutoff) FTMS 101C, 4046 <2 Seconds.
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Wafer Shipping System
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