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Lapping/Polishing CArriers buy in Los Banos
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Lapping/Polishing CArriers

Lapping/Polishing CArriers

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Philippines, Los Banos
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Description
For the purpose of manufacturing high quality semiconductor wafer, the sliced wafer from a silicon ingot requires surface flatness by specular finish and highly uniform thickness. The wafer production processes of ensuring such precision surface flatness and planarization are called lapping and polishing processes.

With the features below, our unique lapping/polishing carriers enable the production of ideal silicon wafers of various sizes: 100, 125, 150, 200 and 300 millimeters.

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Lapping/Polishing CArriers
Lapping/Polishing CArriers
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