CuPRA 3GTM Bonding Tools
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Description
A new advanced solution in fine copper wire bonding, which delivers Excellent bonding, Extended life span and Improved workability with any Copper wire type. CuPRA 3G Key Attributes · ITA Ceramics - a New Material for Longer Life Span · GIC - a New Inner Chamfer Type for Improved Workability · CuPRA 3G New Tip Machining Process CuPRA 3G Major Benefits · Improved Cost of Ownership thanks to a longer capillary life span and better workability · Improved Manufacturing Productivity (MTBA) thanks to the proven mature Granular technology CuPRA 3G capillary life span can be extedned by an average 3 times comapared to CuPRAplus
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CuPRA 3GTM Bonding Tools
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