4500 Series Manual Ball Bonder
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Description
For process development, production, research or added manufacturing support, K&S 4500 Series Manual Ball Bonding Systems provide the high yields and excellent repeatability needed for every gold ball bonding applications, including: · Optoelectronic Modules · Hybrid/MCMs · Microwave Products · Discrete Devices/Lasers · Chip-on-Board
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4500 Series Manual Ball Bonder
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